Articles from StratEdge Corporation

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336 at the International Microwave Symposium (IMS), held at the Moscone Center in San Francisco, from June 17–19. StratEdge packages operate from DC to 63+ GHz and effectively dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical demands of markets such as telecom, broadband wireless, satellite, defense, test and measurement, automotive, and harsh environments.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans Riverside, and in Booth 723 at Space Tech Expo USA, June 2–4 at the Long Beach Convention Center.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging Conference, which takes place April 14–17 in Albuquerque, NM, and at the Components for Military & Space Electronics (CMSE) event, which runs from April 29–May 1 in Los Angeles, CA at Booth B20.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded ceramic package configurations at two premier events this March: the IMAPS Device Packaging Conference (March 3–4, 2025, Phoenix, AZ) and the GOMACTech Conference (March 18–19, 2025, Pasadena, CA).

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise, Vitale Engineering will expand access to StratEdge’s cutting-edge packaging technologies across industries such as aerospace, telecommunications, and defense.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024, during the IMAPS Annual Symposium, recognizing StratEdge's significant contributions to advancing the microelectronics industry and its longstanding support of the IMAPS organization.

StratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California. This strategic partnership is set to extend StratEdge’s advanced packaging solutions into new industries and support rapid growth across telecommunications, aerospace, and defense sectors.

StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 27-30, 2024, in Fort Lauderdale, Florida. IEEE BCICTS will bring together leaders from across the semiconductor industry to discuss and demonstrate the latest advances in integrated circuit technology for applications across automotive, wireless, and aerospace sectors.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France, from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.

StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability assembly services. Engineered to meet the rigorous demands of modern applications, StratEdge’s innovative solutions are tailored for markets including telecom, wireless, satellite, defense, and beyond, ensuring unmatched performance in the most challenging environments.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 515 at the International Microwave Symposium (IMS), being held in Washington, DC, from June 18-20. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-frequency applications at several industry conferences in May. The events will take place in California and Arizona and will highlight StratEdge's commitment to producing packages for demanding GaAs and GaN devices, maximizing the chips’ performance in the most extreme conditions.

StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for demanding applications, today announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona, March 19-20, 2024.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, announces its capabilities for making hybrid packages used in legacy applications where redesigns are difficult or impossible. These hybrid packages, often developed decades ago, are still vital in many critical defense applications.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF, microwave, and millimeter-wave devices, proudly announces its latest presentation, “Package and Die Attach Materials for High-Power GaN Devices,” which was presented at InterPACK 2023 in San Diego in October. This presentation delves into crucial aspects of packaging, materials, and assembly methodologies significant to Gallium Nitride (GaN) devices. StratEdge's research underscores that maximizing thermal dissipation for high-power devices is achievable through the optimization of the die-attach assembly process and package material choices.

StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European Microwave Week (EuMW), September 19-21, IMAPS International, October 3-4, and IEEE BCICTS, October 16-17. StratEdge packages dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) and operate from DC to 63+ GHz. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance, which provide convenience and ease for packaging your high-performance semiconductors.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its off-the-shelf line of molded ceramic packages at European Microwave Week (EuMW), September 19-21. These StratEdge molded ceramic packages are designed to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. Packages are available in over 200 standard outlines, significantly expanding the packaging options for GaN devices. Moreover, StratEdge provides complete automated assembly and environmental test services for these packages, including gold-tin and gold-silicon solder die attach.

StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 2628 at the International Microwave Symposium (IMS), being held in San Diego, CA, from June 13-15. Learn about StratEdge packages that operate across the spectrum from DC to 63+ GHz, while efficiently dissipating heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These clever packages enable compound semiconductor devices to meet the stringent requirements in applications such as defense, satellite, test and measurement, automotive, and down-hole.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place in New Mexico, California, and Florida, and will highlight StratEdge's commitment to producing packages that can survive extreme conditions in space and beyond.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March. The molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz. StratEdge molded ceramic packages come in over 200 standard outlines, dramatically increasing customer packaging options.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter wave devices, today announced that it has extended the performance range for the leaded power amplifier (LPA) family of packages. The breakthrough in the operating range has been extended from DC to 23 Gigahertz (GHz) to 28GHz. The LPA packages are used for test and measurement, VSAT, point-to-point, and point-to-multipoint applications.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, announces that its off-the-shelf line of glass side wall packages, called molded ceramic packages, can be configured to meet the requirements for chips with frequencies up to 18 GHz. StratEdge molded ceramic packages come in over 200 standard outlines, dramatically increasing the packaging options. StratEdge also offers complete assembly and test services for these packages, including automated gold-tin solder die attach, which is ideal for gallium nitride (GaN) and gallium arsenide (GaAs) devices.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz at the International Symposium for Microelectronics (IMAPS) 2022 and BCICTS. StratEdge will be exhibiting in booth 317 at IMAPS, being held in Boston, Massachusetts on Oct. 4-5, and in booth 5 at BCICTS, being held in Phoenix, Arizona from Oct. 17-18.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, announces its assembly services for attaching gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) onto copper-molybdenum-copper (CMC) tabs. StratEdge's proprietary eutectic die attach method maximizes the power output a chip can achieve, optimizing its performance and providing an efficient way to dissipate heat to avoid overheating and failures during normal operation.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 4089 at the International Microwave Symposium (IMS), being held in Denver, CO, from June 21-23. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.

StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for radio frequency, microwave, and millimeter-wave devices, will display power amplifier packages that are playing a key role in transmitting signals from commercial and government satellites and other long-range communications equipment. The keys to success are high-quality and high-reliability package designs that can survive the extreme conditions of space.

StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for radio frequency, microwave, and millimeter-wave devices, will display its thermally-efficient packages at CS MANTECH in booth 17. These packages enable semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the LIVE International Symposium for Microelectronics (IMAPS) 2021 in San Diego, California.

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that the on-demand webinar, “Packages and Eutectic Die Attach for High-power GaN Devices,” is now available on the StratEdge website at www.stratedge.com/webinar.html. Learn how the package in which the gallium nitride (GaN) device is attached, and the method used to attach the device to the package, can optimize the device’s efficiency, performance, and reliability.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 1014 at the International Microwave Symposium (IMS), being held in Atlanta, GA, from June 8-9. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces the release of its SMK Series surface mount DC to 26 Gigahertz (GHz) packages for test and measurement, VSAT, point-to-point, point-to-multipoint, and WiMax applications. These power packages have low insertion loss, good return loss, and excellent thermal properties.